JET SOLDERING APPARATUS

Abstract: a solder removing mechanism is a solder removing mechanism for removing solder from conveyance claws for conveying a substrate to which the solder is supplied. the solder removing comprise an abutment body that can relatively pass through recesses of the conveyance claws or below the conveyance claws

Inventor(s): Yasuji KAWASHIMA, Hiroshi TAGUCHI, Kyoko KURAMOTO, Henri HANZAWA, Tomotake KAGAYA, Katsuhiro SHINOHARA

CPC Classification: B23K3/08 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal ; building up linings or coverings by casting ; casting by dipping ; manufacture of composite layers by sintering metal powder ; arrangements on machine tools for copying or controlling ; covering metals or covering materials with metals, not otherwise provided for ; burners ))

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