Hyundai motor company (20240136296). POWER MODULE simplified abstract
Contents
POWER MODULE
Organization Name
Inventor(s)
So Eun Jeong of Hwaseong-Si (KR)
Jun Hee Park of Hwaseong-Si (KR)
Nam Sik Kong of Hwaseong-Si (KR)
POWER MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136296 titled 'POWER MODULE
Simplified Explanation
The power module described in the patent application consists of an upper substrate, a lower substrate, an upper chip, a lower chip, and a circuit board. The upper and lower substrates are vertically spaced from each other, with the circuit board connecting the upper chip to the lower substrate and the lower chip to the upper substrate.
- Upper and lower substrates are vertically spaced from each other.
- Circuit board connects upper chip to lower substrate and lower chip to upper substrate.
Potential Applications
The technology described in the patent application could be applied in various industries such as electronics, automotive, renewable energy, and telecommunications.
Problems Solved
This technology solves the problem of efficiently connecting and spacing electronic components in a power module, ensuring proper functionality and performance.
Benefits
The benefits of this technology include improved reliability, enhanced performance, and increased efficiency in power modules.
Potential Commercial Applications
The technology could be commercially applied in the manufacturing of power modules for electric vehicles, solar inverters, data centers, and industrial machinery.
Possible Prior Art
One possible prior art could be the use of traditional power module designs with less efficient spacing and connection methods.
Unanswered Questions
How does this technology compare to existing power module designs in terms of cost-effectiveness?
The cost-effectiveness of this technology compared to existing designs is not explicitly addressed in the patent application. Further research and analysis would be needed to determine the cost implications of implementing this technology.
What are the environmental implications of using this technology in electronic devices?
The environmental impact of using this technology in electronic devices is not discussed in the patent application. Additional studies would be required to assess the environmental benefits or drawbacks of incorporating this technology into electronic products.
Original Abstract Submitted
a power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. the circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.
