18337860. SOLDER REFLOW APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SOLDER REFLOW APPARATUS
SOLDER REFLOW APPARATUS
Organization Name
Inventor(s)
Byungkeun Kang of Suwon-si (KR)
SOLDER REFLOW APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18337860 titled 'SOLDER REFLOW APPARATUS
Simplified Explanation
The solder reflow apparatus described in the patent application is designed to uniformly solder electronic parts onto a substrate by applying heat transfer fluid to the central and edge portions of the substrate.
- Reflow chamber configured to receive heat transfer fluid
- Heater to heat the heat transfer fluid
- Stage in the reflow chamber to support the substrate
- Inclined stage to induce heat transfer fluid towards central portion of substrate
- Uniform application of heat transfer fluid to central and edge portions of substrate for uniform soldering
Potential Applications
The technology described in the patent application could be applied in the manufacturing of electronic devices where precise and uniform soldering of electronic parts onto substrates is required.
Problems Solved
This technology solves the problem of uneven soldering of electronic parts onto substrates by ensuring that heat transfer fluid is uniformly applied to both the central and edge portions of the substrate.
Benefits
The benefits of this technology include improved soldering quality, increased efficiency in the manufacturing process, and reduced chances of defects in electronic devices due to uneven soldering.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of smartphones, tablets, and other electronic devices where precise soldering of components onto substrates is crucial for the functionality and reliability of the final product.
Possible Prior Art
One possible prior art for this technology could be existing solder reflow apparatus with different configurations for applying heat transfer fluid to substrates during the soldering process.
Unanswered Questions
How does this technology compare to traditional soldering methods?
This article does not provide a direct comparison between this technology and traditional soldering methods in terms of efficiency, cost-effectiveness, or quality of soldering.
What are the potential limitations or challenges of implementing this technology in large-scale manufacturing processes?
This article does not address the potential challenges or limitations that may arise when implementing this technology in large-scale manufacturing processes, such as scalability, cost implications, or integration with existing production lines.
Original Abstract Submitted
A solder reflow apparatus may include a reflow chamber, a heater and a stage. The reflow chamber may be configured to receive a heat transfer fluid. The heat transfer fluid may be configured for transferring heat to a solder for mounting an electronic part on a substrate. The heater may be configured to heat the heat transfer fluid in the reflow chamber. The stage may be in the reflow chamber to support the substrate. The stage may be inclined to a bottom surface of the reflow chamber to induce the heat transfer fluid toward a central portion of the substrate. Thus, the vertically ascended heat transfer fluid may be uniformly applied to the central portion and an edge portion of the substrate so that the solders at the central portion and the edge portion of the substrate may be uniformly soldered.
