Taiwan semiconductor manufacturing company, ltd. (20240136316). SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chiang-Jui Chu of Yilan County (TW)
Ching-Wen Hsiao of Hsinchu City (TW)
Ming-Da Cheng of Taoyuan City (TW)
Young-Hwa Wu of Tainan City (TW)
Tao-Sheng Chang of Tainan City (TW)
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136316 titled 'SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURFACES
Simplified Explanation
The semiconductor package described in the patent application includes a conductive pillar with two sidewalls of different heights, where solder is in direct contact with the pillar and hangs over both sidewalls.
- The conductive pillar in the semiconductor package has a first sidewall and a second sidewall, with the first sidewall being taller than the second sidewall.
- Solder is placed on and in direct contact with the conductive pillar, hanging over both the first and second sidewalls.
Potential Applications
This technology could be used in:
- Semiconductor packaging
- Electronics manufacturing
Problems Solved
This technology helps with:
- Ensuring proper electrical connections
- Improving the reliability of semiconductor devices
Benefits
The benefits of this technology include:
- Enhanced performance of semiconductor packages
- Increased durability and longevity of electronic devices
Potential Commercial Applications
A potential commercial application for this technology could be in:
- Consumer electronics
- Automotive electronics
Possible Prior Art
One possible prior art for this technology could be:
- Traditional semiconductor packaging methods using different materials and configurations
Unanswered Questions
How does this technology impact the overall cost of semiconductor packaging?
The article does not provide information on the cost implications of implementing this technology in semiconductor packaging.
What are the environmental implications of using this technology in electronics manufacturing?
The article does not address the environmental impact of using this technology in the production of electronic devices.
Original Abstract Submitted
a semiconductor package includes a conductive pillar and a solder. the conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. the solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.
