18946379. CHEMICAL MECHANICAL POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING THE SAME (Samsung Electronics Co., Ltd.)

CHEMICAL MECHANICAL POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Yehwan Kim of Suwon-si KR

Ungyu Paik of Seoul KR

Samjong Choi of Suwon-si KR

Taeseup Song of Seoul KR

Ganggyu Lee of Seoul KR

Donghwan Kim of Seoul KR

CHEMICAL MECHANICAL POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING THE SAME

This abstract first appeared for US patent application 18946379 titled 'CHEMICAL MECHANICAL POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING THE SAME

Original Abstract Submitted

A chemical mechanical polishing pad includes a body having a cylindrical shape and extending in a vertical direction, the body including a plurality of first grooves extending downward in the vertical direction from an upper surface of the body, and a plurality of second grooves extending downward in the vertical direction inside the body. Each of the plurality of first grooves is exposed upward in the vertical direction from the upper surface of the body, each of the plurality of second grooves is located inside the body such that upper ends of the plurality of second grooves is below the upper surface of the body, and at least two of the plurality of first grooves have different depths from each other.