18650525. WAFER PROCESSING APPARATUS AND WAFER PROCESSING SYSTEM INCLUDING THE SAME (Samsung Electronics Co., Ltd.)

WAFER PROCESSING APPARATUS AND WAFER PROCESSING SYSTEM INCLUDING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Da Woon Lee of Suwon-si KR

Jae Heung Lee of Suwon-si KR

Nam-Tae Heo of Suwon-si KR

WAFER PROCESSING APPARATUS AND WAFER PROCESSING SYSTEM INCLUDING THE SAME

This abstract first appeared for US patent application 18650525 titled 'WAFER PROCESSING APPARATUS AND WAFER PROCESSING SYSTEM INCLUDING THE SAME

Original Abstract Submitted

A wafer processing apparatus may include a light source unit emitting a first beam, a first spatial laser modulator reflecting the first beam, a beam expander adjusting a divergence angle of the first beam, a sensor unit emitting a second beam, a second spatial laser modulator reflecting the second beam, a galvanometer reflecting the first beam or the second beam, and a condensing lens refracting the first beam or the second beam. The sensor unit may receive position information generated while the second beam is moving in a first direction on a wafer. The first beam may be condensed to a condensing point by the condensing lens. Angle information for controlling a height level of the condensing point may be generated based on the position information. The beam expander may adjust the divergence angle of the first beam based on the angle information.