Samsung electronics co., ltd. (20250150725). THERMAL IMAGING SENSOR, AND CAMERA MODULE AND ELECTRONIC DEVICE INCLUDING THERMAL IMAGING SENSOR
THERMAL IMAGING SENSOR, AND CAMERA MODULE AND ELECTRONIC DEVICE INCLUDING THERMAL IMAGING SENSOR
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THERMAL IMAGING SENSOR, AND CAMERA MODULE AND ELECTRONIC DEVICE INCLUDING THERMAL IMAGING SENSOR
This abstract first appeared for US patent application 20250150725 titled 'THERMAL IMAGING SENSOR, AND CAMERA MODULE AND ELECTRONIC DEVICE INCLUDING THERMAL IMAGING SENSOR
Original Abstract Submitted
a thermal imaging sensor may include: a pixel array in which pixels with microbolometers are arranged in an m�n matrix, where m and n are integers greater than or equal to 2; a row controller configured to output a row control signal through one or more row control signal lines to select and control a predetermined row from among multiple rows; switches connected to the one or more row control signal lines and disposed at each pixel; and a plurality of column integrators configured to read a current signal from the pixel array obtained through a pixel output line and convert it into a voltage signal.
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