SEMICONDUCTOR PACKAGE

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Inventor(s)

SEMICONDUCTOR PACKAGE

This abstract first appeared for US patent application 20250149480 titled 'SEMICONDUCTOR PACKAGE

Original Abstract Submitted

a semiconductor package includes: a first semiconductor chip; and a second semiconductor chip connected to the first semiconductor chip, wherein the first semiconductor chip includes: a first semiconductor layer; a first through electrode penetrating the first semiconductor layer; and a first connection pad part positioned on the first semiconductor layer and including a plurality of first connection pads connected to the first through electrode, wherein the second semiconductor chip includes: a second semiconductor layer; a second through electrode penetrating the second semiconductor layer; and a second connection pad part positioned on the second semiconductor layer to face the first connection pad part and including a plurality of second connection pads connected to the second through electrode, wherein the plurality of first connection pads is in contact with the plurality of second connection pads, respectively.