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Intel corporation (20250151338). GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ASYMMETRIC SOURCE AND DRAIN CONTACT STRUCTURES

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GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ASYMMETRIC SOURCE AND DRAIN CONTACT STRUCTURES

Organization Name

intel corporation

Inventor(s)

Biswajeet Guha of Hillsboro OR US

Mauro J. Kobrinsky of Portland OR US

Tahir Ghani of Portland OR US

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ASYMMETRIC SOURCE AND DRAIN CONTACT STRUCTURES

This abstract first appeared for US patent application 20250151338 titled 'GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ASYMMETRIC SOURCE AND DRAIN CONTACT STRUCTURES

Original Abstract Submitted

gate-all-around integrated circuit structures having asymmetric source and drain contact structures, and methods of fabricating gate-all-around integrated circuit structures having asymmetric source and drain contact structures, are described. for example, an integrated circuit structure includes a vertical arrangement of nanowires above a fin. a gate stack is over the vertical arrangement of nanowires. a first epitaxial source or drain structure is at a first end of the vertical arrangement of nanowires. a second epitaxial source or drain structure is at a second end of the vertical arrangement of nanowires. a first conductive contact structure is coupled to the first epitaxial source or drain structure. a second conductive contact structure is coupled to the second epitaxial source or drain structure. the second conductive contact structure is deeper along the fin than the first conductive contact structure.

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