Samsung electronics co., ltd. (20240136311). SEMICONDUCTOR PACKAGE simplified abstract

SEMICONDUCTOR PACKAGE

Organization Name

samsung electronics co., ltd.

Inventor(s)

GWANGJAE Jeon of Suwon-si (KR)

MINKI Kim of Suwon-si (KR)

Hyungchul Shin of Suwon-si (KR)

WON IL Lee of Suwon-si (KR)

HYUEKJAE Lee of Suwon-si (KR)

Enbin Jo of Suwon-si (KR)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240136311 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The semiconductor package described in the abstract consists of a lower structure with a first semiconductor substrate, first through vias, first signal pads, first dummy pads, and a first dielectric layer. The upper structure includes a second semiconductor substrate, second signal pads, second dummy pads, and a second dielectric layer. The first signal pad is in contact with one of the second signal pads, and the first dummy pad is in contact with one of the second dummy pads. The spacing between the first dummy pads is 0.5 to 1.5 times the spacing between the first signal pads.

• Lower structure:

   - First semiconductor substrate
   - First through vias
   - First signal pads
   - First dummy pads
   - First dielectric layer

• Upper structure:

   - Second semiconductor substrate
   - Second signal pads
   - Second dummy pads
   - Second dielectric layer

• Interconnection:

   - First signal pad in contact with one of the second signal pads
   - First dummy pad in contact with one of the second dummy pads
   - Specific spacing between first dummy pads and first signal pads

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1. 1. 1. Potential Applications

The technology described in this patent application could be applied in the semiconductor industry for advanced packaging solutions, especially in high-performance computing and telecommunications.

1. 1. 1. Problems Solved

This technology addresses the need for improved interconnection and signal transmission efficiency in semiconductor packages, enhancing overall performance and reliability.

1. 1. 1. Benefits

- Enhanced signal transmission efficiency - Improved interconnection reliability - Increased overall performance of semiconductor packages

1. 1. 1. Potential Commercial Applications
         1. Optimizing Semiconductor Package Interconnection for Enhanced Performance

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1. 1. 1. Possible Prior Art

One possible prior art could be the use of similar interconnection techniques in semiconductor packaging, but with different spacing configurations between signal pads and dummy pads.

1. 1. 1. Unanswered Questions
         1. How does this technology compare to existing semiconductor packaging solutions in terms of performance and reliability?

This article does not provide a direct comparison with existing solutions, leaving room for further analysis and evaluation.

1. 1. 1. 1. What are the specific manufacturing processes involved in implementing this semiconductor package design?

The article does not delve into the detailed manufacturing processes, which could be crucial for understanding the practicality and scalability of this technology.

Original Abstract Submitted

disclosed is a semiconductor package comprising lower and upper structure. the lower structure includes a first semiconductor substrate, first through vias vertically penetrating the first semiconductor substrate, first signal pads connected to the first through vias, first dummy pads between the first signal pads and electrically separated from the first through vias, and a first dielectric layer surrounding the first signal pads and the first dummy pads. the upper structure includes a second semiconductor substrate, second signal pads and second dummy pads, and a second dielectric layer surrounding the second signal pads and the second dummy pads. the first signal pad is in contact with one of the second signal pads. the first dummy pad is in contact with one of the second dummy pads. a first interval between the first dummy pads is 0.5 to 1.5 times a second interval between the first signal pads.