Samsung electronics co., ltd. (20240128239). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Byeongchan Kim of Suwon-si (KR)
Hyunchul Jung of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128239 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a connection structure, via protection layer, first semiconductor chip, through-silicon via (TSV), second semiconductor chip, conductive post, and molding layer.
- The package features a connection structure with a via protection layer to support the first semiconductor chip.
- The first semiconductor chip is connected to the connection structure via a TSV for electrical connectivity.
- A second semiconductor chip is placed on top of the first chip and connected through a conductive post.
- The space between the connection structure and the second chip is filled with a molding layer that encloses the conductive post.
Potential Applications
The technology described in this patent application could be applied in various industries such as electronics, telecommunications, and automotive for advanced semiconductor packaging solutions.
Problems Solved
This technology addresses the need for efficient and reliable electrical connections between multiple semiconductor chips within a single package, enhancing overall performance and functionality.
Benefits
The benefits of this technology include improved electrical connectivity, reduced signal interference, compact package design, and enhanced overall performance of semiconductor devices.
Potential Commercial Applications
- "Advanced Semiconductor Packaging Solutions for Enhanced Performance and Connectivity"
Possible Prior Art
There may be prior art related to semiconductor packaging techniques involving multiple chips and through-silicon vias for electrical connections. Research in the field of semiconductor packaging and integration may reveal similar approaches to achieve multi-chip connectivity.
Unanswered Questions
=== How does this technology compare to traditional single-chip packaging methods in terms of cost-effectiveness and performance efficiency? This article does not provide a direct comparison between the new technology and traditional single-chip packaging methods. Further research and analysis would be needed to evaluate the cost-effectiveness and performance efficiency of this technology in comparison to traditional methods.
=== Are there any limitations or challenges in implementing this technology on a larger scale for mass production? The article does not address potential limitations or challenges in scaling up the production of semiconductor packages using this technology. It would be important to investigate factors such as manufacturing complexity, production costs, and compatibility with existing assembly processes to assess the feasibility of mass production.
Original Abstract Submitted
a semiconductor package includes a connection structure, a via protection layer on the connection structure, a first semiconductor chip on the via protection layer and including a first substrate having a first active face and a first inactive face opposite to each other a through-silicon via (tsv) configured to electrically connect the first semiconductor chip to the connection structure, and a second semiconductor chip on the first semiconductor chip and electrically connected to the first semiconductor chip. the second semiconductor chip includes a second substrate having a second active face and a second inactive face opposite to each other. the package includes a conductive post configured to electrically connect the second semiconductor chip and the connection structure with each other, and a molding layer filling a space between an upper surface of the connection structure and the second semiconductor chip, and the molding layer encloses the conductive post.
