Samsung electronics co., ltd. (20240128172). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128172 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a package substrate with ball pads, wiring lines, and solder mask layers, as well as a semiconductor chip and connection bumps. The connection bumps cover exposed surfaces of the ball pads and solder mask layers, providing a secure connection between the semiconductor chip and the package substrate.
- Package substrate with ball pads, wiring lines, and solder mask layers
- Semiconductor chip mounted on the package substrate
- Connection bumps on the ball pads for connecting to the semiconductor chip
Potential Applications
The technology described in the patent application could be used in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics that require compact and reliable semiconductor packaging.
Problems Solved
This technology solves the problem of ensuring a secure and reliable connection between the semiconductor chip and the package substrate, reducing the risk of electrical failures and improving overall device performance.
Benefits
The benefits of this technology include improved electrical connectivity, increased device reliability, and enhanced performance due to the secure connection provided by the connection bumps.
Potential Commercial Applications
The technology could be applied in the manufacturing of a wide range of electronic devices, making it a valuable innovation for semiconductor packaging in the consumer electronics industry.
Possible Prior Art
One possible prior art could be the use of connection bumps in semiconductor packaging to improve electrical connectivity and reliability.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods in terms of cost-effectiveness and efficiency?
This article does not provide information on the cost-effectiveness and efficiency of this technology compared to existing semiconductor packaging methods.
What impact could this technology have on the overall performance and longevity of electronic devices?
This article does not address the potential impact of this technology on the performance and longevity of electronic devices.
Original Abstract Submitted
a semiconductor package includes a package substrate including a ball pad with first and second pads, a wiring line extending between the first and second pads, and a solder mask layer including a first opening exposing a portion of the first pad and a second opening exposing a portion of the second pad, and a semiconductor chip on an upper surface of the package substrate, and a connection bump on a lower surface of the ball pad and connected to the first and second pads. the connection bump covers a lower surface and a first side surface of the first pad exposed through the first opening, a lower surface and side surfaces of a region of the solder mask layer covering the wiring line, and a lower surface and a first side surface of the second pad exposed through the second opening.
