18631682. ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF (SILICONWARE PRECISION INDUSTRIES CO., LTD.)
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor(s)
Chi-Ching Ho of Taichung City TW
Chao-Chiang Pu of Taichung City TW
Yu-Po Wang of Taichung City TW
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
This abstract first appeared for US patent application 18631682 titled 'ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Original Abstract Submitted
An electronic package and a manufacturing method thereof are provided, in which a plurality of photonic integrated circuit chips and an auxiliary electronic element are separately configured on a package module to shorten the transmission distance of the optical signal. Therefore, the signal transmission rate of a circuit structure can be increased, thereby improving the overall operating performance of the electronic package.
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