18654916. ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF (SILICONWARE PRECISION INDUSTRIES CO., LTD.)

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor(s)

Feng Kao of Taichung City TW

Lung-Yuan Wang of Taichung City TW

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 18654916 titled 'ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

An electronic package and a manufacturing method thereof are provided, in which an electronic module including a carrier structure, at least one first electronic element disposed on a first side of the carrier structure, at least one second electronic element disposed on a second side of the carrier structure, and a plurality of conductive elements is stacked on a substrate via the plurality of conductive elements and a substrate frame, so as to increase an accommodation space between the electronic module and the substrate, thereby preventing the at least one second electronic element of the electronic module from colliding with the substrate.