18754549. ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF (SILICONWARE PRECISION INDUSTRIES CO., LTD.)

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor(s)

Sung-Hua Chung of Taichung City TW

Liang-Pin Chen of Taichung City TW

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 18754549 titled 'ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

An electronic package and a manufacturing method thereof are provided, in which an electronic structure is tightly bonded to a carrier structure via a bonding layer, and the bonding layer includes a first bonding material and a second bonding material adjacent to the first bonding material, so that the second bonding material can fill in a deformation place of the first bonding material to ensure that no void is formed between the bonding layer and the carrier structure after the bonding layer is bonded to the carrier structure.