18385499. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME (NANYA TECHNOLOGY CORPORATION)
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
PING Hsu of NEW TAIPEI CITY TW
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
This abstract first appeared for US patent application 18385499 titled 'SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Original Abstract Submitted
A semiconductor structure and a manufacturing method are provided. The semiconductor structure includes a first substrate having a first side and a second side opposite to the first side, wherein the first side includes a recess recessed from the first side; a first semiconductor die arranged in the recess and bonded to the first side of the first substrate; a second semiconductor die bonded to the second side of the first substrate; a second substrate electrically bonded to the first side of the first substrate; a plurality of conductive vias positioned along the second substrate and extending through the second substrate; and a plurality of conductive lines positioned on the second substrate.
