18495804. METAL COUPON WITH POROUS STRESS-RELIEF SECTION, COMPONENT WITH SAME AND RELATED METHOD (GE Infrastructure Technology LLC)
METAL COUPON WITH POROUS STRESS-RELIEF SECTION, COMPONENT WITH SAME AND RELATED METHOD
Organization Name
GE Infrastructure Technology LLC
Inventor(s)
Evan John Dozier of Greenville SC US
Nathan Nicholas Ostrout of Greenville SC US
Jacob Andrew Salm of Simpsonville SC US
Mark Lawrence Hunt of Greenville SC US
Stanley Frank Simpson of Greenville SC US
James Warren Pemrick of Troy NY US
METAL COUPON WITH POROUS STRESS-RELIEF SECTION, COMPONENT WITH SAME AND RELATED METHOD
This abstract first appeared for US patent application 18495804 titled 'METAL COUPON WITH POROUS STRESS-RELIEF SECTION, COMPONENT WITH SAME AND RELATED METHOD
Original Abstract Submitted
A component including a body, and an additively manufactured (AM) metal coupon including a first section and a stress-relief section, is disclosed. The stress-relief section includes a porous region having a porosity between 2% to 50% open space volume to total volume of the stress-relief section. The stress-relief section has at least one of thermal conductivity, tensile strength, ductility, or fatigue strength less than first section. A braze material couples the AM metal coupon to a coupon opening in the body. The stress-relief section creates a low-stress zone in the metal coupon that can be located near or adjacent to a high-stress zone. The stress-relief section reduces residual stress in the metal coupon, which reduces the related challenges of coupling the metal coupon to the body of the component, especially where superalloy materials are used.
- GE Infrastructure Technology LLC
- Evan John Dozier of Greenville SC US
- Nathan Nicholas Ostrout of Greenville SC US
- Jacob Andrew Salm of Simpsonville SC US
- Mark Lawrence Hunt of Greenville SC US
- Stanley Frank Simpson of Greenville SC US
- James Warren Pemrick of Troy NY US
- F01D5/00
- B23K1/00
- B23K101/00
- B23P6/04
- B33Y10/00
- B33Y80/00
- CPC F01D5/005
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