18913256. OPTICAL PACKAGE COMPRISING A COATING BETWEEN AN OPTICAL ELEMENT AND AN ELECTRONIC CHIP (STMicroelectronics International N.V.)

OPTICAL PACKAGE COMPRISING A COATING BETWEEN AN OPTICAL ELEMENT AND AN ELECTRONIC CHIP

Organization Name

STMicroelectronics International N.V.

Inventor(s)

Younes Boutaleb of Grenoble FR

Julien Cuzzocrea of MONTBONNOT ST MARTIN FR

OPTICAL PACKAGE COMPRISING A COATING BETWEEN AN OPTICAL ELEMENT AND AN ELECTRONIC CHIP

This abstract first appeared for US patent application 18913256 titled 'OPTICAL PACKAGE COMPRISING A COATING BETWEEN AN OPTICAL ELEMENT AND AN ELECTRONIC CHIP

Original Abstract Submitted

The present disclosure provides an optical package. An example optical package includes: a support substrate having a mounting face equipped with first electrically conductive contact pads; an electronic chip comprising a front face including second contact pads electrically connected to the first contact pads by conductive wires; a film on wire type coating that coats a first portion at least of the conductive wires and the second contact pads; and an optical element attached on the coating, the coating delimiting an inner housing between the optical element and the front face of the electronic chip.