18735435. SEMICONDUCTOR MANUFACTURING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS, AND SEMICONDUCTOR APPARATUS (Mitsubishi Electric Corporation)

SEMICONDUCTOR MANUFACTURING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS, AND SEMICONDUCTOR APPARATUS

Organization Name

Mitsubishi Electric Corporation

Inventor(s)

Takeru Zaima of Tokyo JP

SEMICONDUCTOR MANUFACTURING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS, AND SEMICONDUCTOR APPARATUS

This abstract first appeared for US patent application 18735435 titled 'SEMICONDUCTOR MANUFACTURING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS, AND SEMICONDUCTOR APPARATUS

Original Abstract Submitted

A nozzle of a semiconductor manufacturing apparatus includes a cross groove provided on a bottom surface, a supply hole provided in the center of the cross groove, and exhaust grooves that extend from ends of the cross groove to the outside of the bottom surface on the bottom surface and are shallower than the cross groove. The semiconductor manufacturing apparatus includes the nozzle, a syringe connected to the nozzle, and a dispenser that fills, in the cross groove, resin paste in the syringe via the supply hole with a gas pressure or an air pressure.