18790371. DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME
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DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME
This abstract first appeared for US patent application 18790371 titled 'DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME
Original Abstract Submitted
A wafer on which a hydrophilic pattern is applied is provided to a die seat on which a first magnetic pattern is formed and a hydrophobic pattern is applied around the hydrophilic pattern. Liquid is dispensed to the die seat. A first die on which a second magnetic pattern is formed is seated on the wafer and the first die is first-aligned using capillary force of the liquid. Liquid is dispensed onto an upper surface of the first die. A second die is seated on the upper surface of the first die and the second die is first-aligned with capillary force of the liquid on the upper surface of the first die. A magnetic field is generated in the first magnetic pattern and the second magnetic pattern and the first magnetic pattern and the second magnetic pattern are secondly-aligned using magnetic force.
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