18830845. MULTI-COMPONENT THIN FILM, METHOD OF MANUFACTURING THE SAME, AND IC DEVICE INCLUDING THE MULTI-COMPONENT THIN FILM (SAMSUNG ELECTRONICS CO., LTD.)

MULTI-COMPONENT THIN FILM, METHOD OF MANUFACTURING THE SAME, AND IC DEVICE INCLUDING THE MULTI-COMPONENT THIN FILM

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Jungmin Park of Suwon-si KR

Haeryong Kim of Suwon-si KR

Boeun Park of Suwon-si KR

Jeongil Bang of Suwon-si KR

Jooho Lee of Suwon-si KR

Hanjin Lim of Suwon-si KR

Hyungsuk Jung of Suwon-si KR

Sumin Hwang of Suwon-si KR

MULTI-COMPONENT THIN FILM, METHOD OF MANUFACTURING THE SAME, AND IC DEVICE INCLUDING THE MULTI-COMPONENT THIN FILM

This abstract first appeared for US patent application 18830845 titled 'MULTI-COMPONENT THIN FILM, METHOD OF MANUFACTURING THE SAME, AND IC DEVICE INCLUDING THE MULTI-COMPONENT THIN FILM

Original Abstract Submitted

A method of manufacturing a multi-component thin film includes providing a substrate into a process chamber, performing a first cycle, the first cycle including forming a first atomic layer including a first precursor on the substrate by using an atomic layer deposition process, performing a third cycle, the third cycle including injecting an additive onto the first atomic layer, and performing a second cycle, the second cycle including forming a second atomic layer including a second precursor on the first atomic layer and the additive by using an atomic layer deposition process, wherein a thermal decomposition temperature of the additive is lower than each of a thermal decomposition temperature of the first precursor and a thermal decomposition temperature of the second precursor.