Samsung electronics co., ltd. (20250137131). DEPOSITION APPARATUS AND METHOD OF DEPOSITING SUBSTRATE
DEPOSITION APPARATUS AND METHOD OF DEPOSITING SUBSTRATE
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DEPOSITION APPARATUS AND METHOD OF DEPOSITING SUBSTRATE
This abstract first appeared for US patent application 20250137131 titled 'DEPOSITION APPARATUS AND METHOD OF DEPOSITING SUBSTRATE
Original Abstract Submitted
a deposition apparatus includes: a chamber; a support unit within the chamber and including a chuck and a driving member, wherein a substrate is seated on the chuck, wherein the chuck has a first process position and a second process position, wherein the first process position is for processing the substrate in a first process, wherein the second process position is for processing the substrate in a second process, wherein the driving member moves the chuck between the first process position and the second process position; a showerhead supplying process gas toward the substrate, when the chuck is located in the first process position; a power supply unit supplying power to generate plasma between the chuck and the showerhead; and a first ultraviolet lamp disposed in the chamber and emitting ultraviolet rays toward the substrate, when the chuck is located in the second process position.
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