Samsung electronics co., ltd. (20250135591). SPIN CHUCK AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
SPIN CHUCK AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
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SPIN CHUCK AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
This abstract first appeared for US patent application 20250135591 titled 'SPIN CHUCK AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
Original Abstract Submitted
a spin chuck includes an upper plate having an upper surface and a lower surface, the upper plate including a groove and a support pin on the upper surface of the upper plate, wherein the support pin is configured to support a substrate; an anti-slip plate below the upper plate, the anti-slip plate having an upper surface and a lower surface, wherein the anti-slip plate includes a first protrusion protruding in a vertical direction from the upper surface of the anti-slip plate toward the upper plate; and a lower plate below the anti-slip plate, the lower plate including a chucking pin configured to fix the substrate, wherein the lower plate has an upper surface and a lower surface, wherein the first protrusion of the anti-slip plate is coupled to the groove of the upper plate.
