Samsung electronics co., ltd. (20250125160). SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
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SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
This abstract first appeared for US patent application 20250125160 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Original Abstract Submitted
a substrate processing apparatus includes a process chamber including a processing space, a substrate support configured to support a substrate in the process chamber, a fluid supply tube arranged in a lower portion of the process chamber, and a fluid supply device configured to supply a supercritical fluid to the processing space through the fluid supply tube, wherein the substrate support includes a plate structure, which is arranged in a central region of the substrate support, and on which the substrate is settled, a turbulence reduction body having a ring shape and joined to an outer portion of the plate structure, and a turbulence reduction wing joined to an outer portion of the turbulence reduction body and tilted at a certain angle toward the lower portion of the process chamber.