Meta platforms technologies, llc (20250126751). SYSTEMS AND METHODS FOR THREE-DIMENSIONAL HEAT TRANSFER ARCHITECTURES MANUFACTURED BY SELECTIVE PLATING
SYSTEMS AND METHODS FOR THREE-DIMENSIONAL HEAT TRANSFER ARCHITECTURES MANUFACTURED BY SELECTIVE PLATING
Organization Name
meta platforms technologies, llc
Inventor(s)
Brian Toleno of Cupertino CA US
Michael Nikkhoo of Saratoga CA US
SYSTEMS AND METHODS FOR THREE-DIMENSIONAL HEAT TRANSFER ARCHITECTURES MANUFACTURED BY SELECTIVE PLATING
This abstract first appeared for US patent application 20250126751 titled 'SYSTEMS AND METHODS FOR THREE-DIMENSIONAL HEAT TRANSFER ARCHITECTURES MANUFACTURED BY SELECTIVE PLATING
Original Abstract Submitted
a method for constructing heat transfer architectures for use in wearables or other small electronic devices using selective micro plating to quickly and precisely generate complex 3d microstructures, a heat transfer architecture, and electronic device with a heat transfer architecture includes creating capillary wick structures, wherein the capillary wick structures may vary in characteristics. an interface may be generated with a vessel wall to provide an optimal interface between the capillary wick structures and the vessel wall.