18480526. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Chen-Hsuan Tsai of Taitung City TW

Chin-Chuan Chang of Hsinchu County TW

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

This abstract first appeared for US patent application 18480526 titled 'SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

Original Abstract Submitted

A method of forming a semiconductor package includes the following operations. At least one integrated circuit structure is provided and bonded to an interposer structure. A photonic structure is provided and bonded to the interposer structure, wherein the photonic structure has a recessed feature covered by a mask and facing a light source. An encapsulation layer is formed around the at least one integrated circuit structure and the photonic structure. At least a portion of the mask layer is removed from the photonic structure.