18410301. Semiconductor Packages and Methods of Forming (Taiwan Semiconductor Manufacturing Co., Ltd.)

Semiconductor Packages and Methods of Forming

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Hsin Chang of Hsinchu TW

Po-Han Wang of Hsinchu TW

Yu-Hsiang Hu of Hsinchu TW

Hung-Jui Kuo of Hsinchu TW

Semiconductor Packages and Methods of Forming

This abstract first appeared for US patent application 18410301 titled 'Semiconductor Packages and Methods of Forming

Original Abstract Submitted

A method of forming a semiconductor package includes: surrounding a die with a molding material; and forming a redistribution structure (RDS) over the molding material and electrically coupled to the die, which includes: depositing a first dielectric layer over the molding material; patterning the first dielectric layer to form first openings in the first dielectric layer; performing a first descum process to clean the first openings; after performing the first descum process, forming a first redistribution layer (RDL) on the first dielectric layer; depositing a second dielectric layer over the molding material; patterning the second dielectric layer to form second openings in the second dielectric layer; performing a second descum process to clean the second openings, where the first and second descum processes are performed under different process conditions; and after performing the second descum process, forming a second RDL on the second dielectric layer.