18895887. INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
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INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
This abstract first appeared for US patent application 18895887 titled 'INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
Original Abstract Submitted
In the integrated circuit device and a method of manufacturing the same according to an embodiment, in a structure including a backside power distribution network for a device region having an area reduced based on down-scaling, a contact-merged bridge is formed on a source/drain contact, and thus, difficulty of a manufacturing process may be reduced and electrical characteristics may be enhanced.
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