18733206. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Seungryong Oh of Suwon-si KR

Jaejun Lee of Suwon-si KR

Junho Lee of Suwon-si KR

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

This abstract first appeared for US patent application 18733206 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Original Abstract Submitted

A semiconductor package includes a first semiconductor chip including a semiconductor substrate having an active surface and an inactive surface, a device layer on the active surface, first chip pads on the device layer, and a first through-electrode and a second through-electrode, where the first through-electrode and the second through-electrode penetrate the semiconductor substrate, at least one of the first chip pads is connected to the first through-electrode and at least one of the first chip pads is connected to the second through-electrode, a redistribution structure including a redistribution layer on the inactive surface of the semiconductor substrate and a redistribution via connected to the redistribution layer, contact pads on an upper surface of the redistribution structure, and a second semiconductor chip on the redistribution structure and including second chip pads connected to the contact pads.