Applied materials, inc. (20250114909). COLD LIQUID POLISHING CONTROL
COLD LIQUID POLISHING CONTROL
Organization Name
Inventor(s)
Priscilla Diep Larosa of San Jose CA US
Chih Chung Chou of San Jose CA US
Taketo Sekine of Cupertino CA US
Chen-Wei Chang of San Jose CA US
Jianshe Tang of San Jose CA US
Songling Shin of Sunnyvale CA US
COLD LIQUID POLISHING CONTROL
This abstract first appeared for US patent application 20250114909 titled 'COLD LIQUID POLISHING CONTROL
Original Abstract Submitted
a chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid dispenser having a polishing liquid port positioned over the platen to deliver polishing liquid onto the polishing pad, a temperature control system including coolant liquid fluid reservoirs for containing coolant fluids, a thermal controller configured to control the temperature of the coolant fluid within the coolant fluid reservoirs, and a first dispenser having openings in fluid connection with the coolant fluid reservoirs, the openings positioned configured to spray an aerosolized coolant liquid directly onto the polishing pad, and a second dispenser having a coolant port in fluid connection with the coolant fluid reservoirs, the coolant port positioned over the platen and configured to flow a stream of coolant liquid directly onto the polishing pad.
- Applied materials, inc.
- Priscilla Diep Larosa of San Jose CA US
- Chih Chung Chou of San Jose CA US
- Haosheng Wu of San Jose CA US
- Taketo Sekine of Cupertino CA US
- Chen-Wei Chang of San Jose CA US
- Elton Zhong of San Jose CA US
- Jianshe Tang of San Jose CA US
- Songling Shin of Sunnyvale CA US
- B24B55/03
- B24B37/015
- B24B37/20
- CPC B24B55/03