Apple inc. (20240105617). Vertical Transistors With Backside Power Delivery simplified abstract
Contents
- 1 Vertical Transistors With Backside Power Delivery
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Vertical Transistors With Backside Power Delivery - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Vertical Transistors With Backside Power Delivery
Organization Name
Inventor(s)
Praveen Raghavan of Los Gatos CA (US)
Thomas Hoffmann of Los Gatos CA (US)
Vertical Transistors With Backside Power Delivery - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105617 titled 'Vertical Transistors With Backside Power Delivery
Simplified Explanation
The patent application describes structures that combine topside metal routing and backside metal routing with vertical transistors, including a building block cell with a metal contact layer between the backside metal routing and the vertical transistors. Various connections within the building block cell can create more complex structures such as inverter devices, NAND devices, and multiplexer devices.
- Building block cell with metal contact layer
- Combination of topside metal routing, backside metal routing, and vertical transistors
- Formation of complex structures like inverters, NAND devices, and multiplexers
Potential Applications
The technology described in the patent application could be applied in the following areas:
- Integrated circuits
- Semiconductor devices
- Electronic systems
Problems Solved
The technology addresses the following issues:
- Efficient routing of metal in semiconductor devices
- Integration of vertical transistors with metal routing
- Creation of complex structures within a building block cell
Benefits
The technology offers the following benefits:
- Improved performance of semiconductor devices
- Enhanced functionality of integrated circuits
- Increased design flexibility for electronic systems
Potential Commercial Applications
The technology could find commercial applications in:
- Semiconductor manufacturing companies
- Electronics industry
- Research and development organizations
Possible Prior Art
One possible prior art for this technology could be the integration of metal routing with vertical transistors in semiconductor devices.
Unanswered Questions
How does this technology compare to existing methods of integrating metal routing with vertical transistors?
The article does not provide a direct comparison with existing methods, leaving the reader to wonder about the specific advantages or differences of this new approach.
What are the specific design considerations for implementing this technology in different types of semiconductor devices?
The article does not delve into the specific design considerations for implementing this technology in various semiconductor devices, leaving a gap in understanding the practical application of the innovation.
Original Abstract Submitted
various structures that implement topside metal routing and backside metal routing in combination with vertical transistors are disclosed. the various structures include a building block cell with a metal contact layer between the backside metal routing and the vertical transistors. various connections can be made within the building block cell to form more complex structures such as, but not limited to, inverter devices, nand devices, and mux (multiplexer) devices.
