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Taiwan semiconductor manufacturing co., ltd. (20250112050). POLISHING APPARATUS HAVING BEAM FOR SURFACE TREATMENT AND POLISHING METHOD USING THE SAME

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POLISHING APPARATUS HAVING BEAM FOR SURFACE TREATMENT AND POLISHING METHOD USING THE SAME

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Jin-Hao Jhang of Hsinchu County TW

Wei-Yen Woon of Taoyuan City TW

Szuya Liao of Hsinchu County TW

POLISHING APPARATUS HAVING BEAM FOR SURFACE TREATMENT AND POLISHING METHOD USING THE SAME

This abstract first appeared for US patent application 20250112050 titled 'POLISHING APPARATUS HAVING BEAM FOR SURFACE TREATMENT AND POLISHING METHOD USING THE SAME

Original Abstract Submitted

a method includes providing a wafer including a layer; projecting a beam for a surface treatment on the layer to form a material-modified portion at a top of the layer, wherein the material-modified portion is spaced apart from a bottom surface of the layer; and polishing, by using a polishing pad, the material-modified portion of the layer.

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