Jump to content

18893820. HIGH DENSITY CAPACITOR AND MANUFACTURING METHOD THEREFOR (ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE)

From WikiPatents
Revision as of 05:15, 31 March 2025 by Unknown user (talk) (Creating a new page)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)

HIGH DENSITY CAPACITOR AND MANUFACTURING METHOD THEREFOR

Organization Name

ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor(s)

SangHwa Yoo of Daejeon KR

Heuk Park of Daejeon KR

Joon Ki Lee of Sejong-si KR

HIGH DENSITY CAPACITOR AND MANUFACTURING METHOD THEREFOR

This abstract first appeared for US patent application 18893820 titled 'HIGH DENSITY CAPACITOR AND MANUFACTURING METHOD THEREFOR

Original Abstract Submitted

A high-density capacitor and a method for manufacturing the same are disclosed. The high-density capacitor includes a metal-oxide-semiconductor (MOS) capacitor having a silicon layer with a dopant concentration of at least 1×1020 cm-3; a first dielectric layer formed on above the silicon layer, and a first metal layer formed above the first dielectric layer.

Cookies help us deliver our services. By using our services, you agree to our use of cookies.