Tesla, inc. (20250105085). A METHOD FOR APPLYING A COOLING SOLUTION TO ONE OR MORE INTEGRATED CIRCUIT COMPONENTS AND ASSEMBLE FOR INTEGRATED CIRCUIT COOLING
A METHOD FOR APPLYING A COOLING SOLUTION TO ONE OR MORE INTEGRATED CIRCUIT COMPONENTS AND ASSEMBLE FOR INTEGRATED CIRCUIT COOLING
Organization Name
Inventor(s)
Mohamed Haitham Helmy Nasr of Sunnyvale CA US
Srikumar Seshasayee Iyengar of San Jose CA US
Surinderpal Singh Jassal of Dublin CA US
Aleksandar Plavsic of Mequon WI US
A METHOD FOR APPLYING A COOLING SOLUTION TO ONE OR MORE INTEGRATED CIRCUIT COMPONENTS AND ASSEMBLE FOR INTEGRATED CIRCUIT COOLING
This abstract first appeared for US patent application 20250105085 titled 'A METHOD FOR APPLYING A COOLING SOLUTION TO ONE OR MORE INTEGRATED CIRCUIT COMPONENTS AND ASSEMBLE FOR INTEGRATED CIRCUIT COOLING
Original Abstract Submitted
a method can include attaching an integrated circuit to a printed circuit board in a first solder reflow process at a first reflow temperature. a method can include soldering a heat spreader to the integrated circuit in a second solder reflow process at a second reflow temperature, wherein the second reflow temperature is lower than the first reflow temperature. a method can include attaching a cold plate to the heat spreader such that a thermal interface material is positioned between the heat spreader and the cold plate. related integrated circuit assemblies are disclosed with thermal interface material, such as solder or a liquid metal, positioned between a heat spreader and an integrated circuit. the thermal interface material has a lower melting temperature than solder on another surface of the integrated circuit.