Samsung electronics co., ltd. (20250024690). MEMORY CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

MEMORY CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Organization Name

samsung electronics co., ltd.

Inventor(s)

JEON IL Lee of Suwon-si KR

MEMORY CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

This abstract first appeared for US patent application 20250024690 titled 'MEMORY CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Original Abstract Submitted

a memory chip includes a cell chip and a core-periphery chip, which are vertically stacked and are electrically connected to each other. the cell chip includes cell regions, each of which includes a memory cell layer. the core-periphery chip includes a core group region and a peripheral region which are adjacent to each other in a first direction. the core group region includes core regions arranged in a line in a second direction intersecting the first direction. each of the core regions includes a core bank including a core circuit, and a neural processing unit (npu) block including an npu.