US Patent Application 18338372. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
YANGGYOO Jung of Suwon-si (KR)
HYO-CHANG Ryu of Suwon-si (KR)
YUN SEOK Choi of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18338372 Titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME'
Simplified Explanation
The abstract describes a semiconductor package that consists of multiple layers and components. It includes a package substrate, an interposer substrate, and a semiconductor chip. The interposer substrate has two base layers with circuit patterns and an integrated device embedded in one of the base layers. The first base layer is in contact with the second base layer.
Original Abstract Submitted
A semiconductor package may include a package substrate, a first interposer substrate mounted on the package substrate, and a first semiconductor chip disposed on the first interposer substrate. The first interposer substrate may include a first base layer, a second base layer disposed on the first base layer, circuit patterns provided in each of the first base layer and the second base layer, and an integrated device embedded in the first base layer and connected to at least one of the circuit patterns. A top surface of the first base layer may contact a bottom surface of the second base layer.
