17823458. Die Disablement simplified abstract (Micron Technology, Inc.)
Contents
Die Disablement
Organization Name
Inventor(s)
Kang-Yong Kim of Boise ID (US)
Die Disablement - A simplified explanation of the abstract
This abstract first appeared for US patent application 17823458 titled 'Die Disablement
Simplified Explanation
The patent application describes apparatuses and methods for selectively disabling a die in a multiple-die package without disabling all the remaining dies. A nonvolatile circuit, such as fuses, is included within individual dies or the package to maintain a value indicative of die operability. Die disablement logic can disable the die based on the value, with an override signal allowing or preventing the disabling. This allows for preventing a defective die from functioning while still allowing for testing or debugging.
- Nonvolatile circuit, such as fuses, included within individual dies or package
- Circuit maintains a value indicative of die operability
- Die disablement logic can disable die based on value
- Override signal allows or prevents disabling
- Enables prevention of defective die from functioning while allowing for testing or debugging
Potential Applications
- Semiconductor manufacturing
- Electronic device testing
- Debugging processes
Problems Solved
- Preventing defective dies from affecting overall package functionality
- Allowing for selective disabling of individual dies
- Facilitating testing and debugging processes
Benefits
- Improved yield in multiple-die packages
- Enhanced quality control in semiconductor manufacturing
- Efficient testing and debugging capabilities
Original Abstract Submitted
Described apparatuses and methods relate to selectively disabling a die that may be included in a multiple-die package without necessarily disabling all the remaining dies within the package. A nonvolatile circuit, such as one or more fuses, may be included within individual dies and/or otherwise incorporated within the package. The nonvolatile circuit maintains a value for the die that is indicative of the operability of the die. Die disablement logic is operatively coupled to the nonvolatile circuit and can disable the die based on the value indicating that the die is unusable. The disabling of the die by the die disablement logic may be controlled by an override signal that allows the disabling or prevents the logic from disabling the die. Thus, the die disablement logic can prevent a defective die from functioning, but the die disablement logic may be overridden for testing or debugging.
