Samsung electronics co., ltd. (20250096214). SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
YOUNG LYONG Kim of Suwon-si KR
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
This abstract first appeared for US patent application 20250096214 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Original Abstract Submitted
an embodiment provides a semiconductor package including: a redistribution structure; an interconnection structure on the redistribution structure; a memory stacking structure disposed on the redistribution structure and including a buffer die and core dies stacked on the buffer die; a semiconductor die disposed on the buffer die and on the interconnection structure; and an optical engine disposed on the interconnection structure.
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