Intel corporation (20250096052). LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTRONIC ASSEMBLIES
LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTRONIC ASSEMBLIES
Organization Name
Inventor(s)
Mohamed R. Saber of College Station TX US
Srinivas V. Pietambaram of Chandler AZ US
Naiya Soetan-dodd of Mesa AZ US
LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTRONIC ASSEMBLIES
This abstract first appeared for US patent application 20250096052 titled 'LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTRONIC ASSEMBLIES
Original Abstract Submitted
microelectronic assemblies with glass cores that have undergone localized thermal healing and/or localized doping in regions adjacent to glass surface are disclosed. in one example, a microelectronic assembly includes a glass core having a first face, an opposing second face, a sidewall extending between the first face and the second face, a surface region, and a bulk region, where the surface region is a portion of the glass core that starts at a surface of the first face, the second face, or the sidewall and extends from the surface into the glass core by a total depth of up to about 50 micron, the bulk region is a portion of the glass core further away from the surface than the surface region, and a density of the surface region is higher than a density of the bulk region, e.g., at least about 5% higher or at least about 7.5% higher.
- Intel corporation
- Mohamed R. Saber of College Station TX US
- Hanyu Song of Chandler AZ US
- Fanyi Zhu of Gilbert AZ US
- Bai Nie of Chandler AZ US
- Srinivas V. Pietambaram of Chandler AZ US
- Deniz Turan of Chander AZ US
- Yonggang Li of Chandler AZ US
- Naiya Soetan-dodd of Mesa AZ US
- Shuren Qu of Gilbert AZ US
- H01L23/15
- H01L21/48
- H01L23/00
- H01L23/48
- H01L25/065
- CPC H01L23/15
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