20240052206. ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND METHOD FOR MANUFACTURING STRUCTURE simplified abstract (LINTEC CORPORATION)
Contents
ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND METHOD FOR MANUFACTURING STRUCTURE
Organization Name
Inventor(s)
Koji Tsuchibuchi of Itabashi-ku, Tokyo (JP)
Naoki Taya of Itabashi-ku Tokyo (JP)
ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND METHOD FOR MANUFACTURING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240052206 titled 'ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND METHOD FOR MANUFACTURING STRUCTURE
Simplified Explanation
The abstract describes a high-frequency dielectric heating adhesive that is designed to bond three or more adherends. The adhesive contains a thermoplastic resin and a dielectric filler that generates heat when a high-frequency electric field is applied. The MVR (Melt Volume Rate) of the adhesive is in a range from 1 to 300 cm/10 min, with the lower-limit temperature (tl) and upper-limit temperature (tu) defined by specific numerical formulas.
- The high-frequency dielectric heating adhesive is formulated to bond multiple adherends.
- It contains a thermoplastic resin and a dielectric filler that generates heat under a high-frequency electric field.
- The MVR of the adhesive is within a specific range, indicating its flowability and suitability for bonding applications.
Potential Applications:
- This adhesive can be used in various industries where bonding of multiple materials is required, such as automotive, aerospace, electronics, and construction.
- It can be used for bonding different types of materials, including metals, plastics, ceramics, and composites.
Problems Solved:
- The high-frequency dielectric heating adhesive provides a reliable and efficient bonding solution for joining multiple adherends.
- It eliminates the need for traditional heating methods, such as ovens or hot plates, by utilizing the heat generated through dielectric heating.
- The adhesive offers a fast and precise bonding process, reducing production time and costs.
Benefits:
- The adhesive allows for the bonding of three or more adherends, expanding the possibilities for complex assemblies.
- It provides a strong and durable bond, ensuring the integrity and longevity of the joined materials.
- The high-frequency dielectric heating process offers a more energy-efficient and environmentally friendly bonding method compared to conventional heating techniques.
Original Abstract Submitted
a high-frequency-dielectric-heating adhesive configured to bond three or more adherends is provided. the high-frequency-dielectric-heating adhesive contains a thermoplastic resin and a dielectric filler configured to generate heat upon application of a high-frequency electric field. mvr of the high-frequency-dielectric-heating adhesive in a range from a lower-limit temperature tl to an upper-limit temperature tu is in a range from 1 to 300 cm/10 min, where the lower-limit temperature tl (unit: degrees c.) is defined by a numerical formula (numerical formula 11) below and the upper-limit temperature tu (unit: degrees c.) is defined by a numerical formula (numerical formula 12) below,