18671284. MULTILAYER ELECTRONIC COMPONENT (Samsung Electro-Mechanics Co., Ltd.)
MULTILAYER ELECTRONIC COMPONENT
Organization Name
Samsung Electro-Mechanics Co., Ltd.
Inventor(s)
Sung Hyung Kang of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT
This abstract first appeared for US patent application 18671284 titled 'MULTILAYER ELECTRONIC COMPONENT
Original Abstract Submitted
A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and an internal electrode, alternately arranged in a first direction, and a cover portion disposed on both surfaces of the capacitance forming portion opposing the first direction; and an external electrode disposed outside the body and connected to the internal electrode, wherein the cover portion includes a first dielectric material having a perovskite structure represented by the formula ABO, and a first metal including one or more of Cu, W, Ag, and Zn, and wherein, in at least a portion of the cover portion, an amount of the first metal is 2.0 mole or more and 9.0 mole or less, based on 100 mole of an element of B.