RADIO FREQUENCY MODULE

Organization Name

Inventor(s)

RADIO FREQUENCY MODULE

This abstract first appeared for US patent application 20250070805 titled 'RADIO FREQUENCY MODULE

Original Abstract Submitted

a radio frequency module includes a wiring board, a first electronic component and a second electronic component, and a third electronic component connected to a matching circuit. the wiring board includes a core board having not only a first principal surface and a second principal surface but also a through hole, a first buildup layer stacked on the first principal surface, and a second buildup layer stacked on the second principal surface. at least one of the first electronic component or the second electronic component is disposed partially inside the through hole. the third electronic component is disposed on the first buildup layer. the second electronic component is stacked on one side, where the third electronic component is located, of the first electronic component in a thickness direction defined for the core board. the second electronic component is a constituent component of the matching circuit.