18282023. MULTILAYER SUBSTRATE, INTEGRATED MAGNETIC DEVICE, POWER SOURCE APPARATUS, AND MULTILAYER SUBSTRATE PRODUCTION METHOD simplified abstract (NEC Corporation)
MULTILAYER SUBSTRATE, INTEGRATED MAGNETIC DEVICE, POWER SOURCE APPARATUS, AND MULTILAYER SUBSTRATE PRODUCTION METHOD
Organization Name
Inventor(s)
Hiromitsu Tahara of Kanagawa (JP)
MULTILAYER SUBSTRATE, INTEGRATED MAGNETIC DEVICE, POWER SOURCE APPARATUS, AND MULTILAYER SUBSTRATE PRODUCTION METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18282023 titled 'MULTILAYER SUBSTRATE, INTEGRATED MAGNETIC DEVICE, POWER SOURCE APPARATUS, AND MULTILAYER SUBSTRATE PRODUCTION METHOD
Simplified Explanation
The present disclosure describes a multilayer substrate that consists of multiple substrates with wired conductors and an insulation material with added first insulation particles. The substrate has a lamination structure where adjacent substrates have first insulation particles that are in contact with the conductors on the neighboring substrates.
- The multilayer substrate includes multiple substrates with wired conductors.
- An insulation material is used, which contains first insulation particles with a specific diameter.
- The lamination structure of the substrate ensures that the first insulation particles are in contact with the conductors on adjacent substrates.
- The diameter of the first insulation particles is similar to the interval between the conductors on the two substrates.
Potential Applications:
- Electronics manufacturing: The multilayer substrate can be used in the production of electronic devices such as circuit boards and semiconductor packages.
- Communication systems: The substrate can be utilized in the development of high-frequency communication systems and devices.
Problems Solved:
- Electrical insulation: The addition of first insulation particles enhances the insulation properties of the substrate, preventing electrical short circuits.
- Signal integrity: The contact between the first insulation particles and the conductors ensures proper signal transmission without interference.
Benefits:
- Improved reliability: The multilayer substrate with enhanced insulation reduces the risk of electrical failures and improves the overall reliability of electronic devices.
- Enhanced performance: The proper contact between the first insulation particles and conductors helps maintain signal integrity, leading to better performance in communication systems.
- Cost-effective manufacturing: The use of the multilayer substrate simplifies the production process of electronic devices, potentially reducing manufacturing costs.
Original Abstract Submitted
The multilayer substrate according to the present disclosure includes: a plurality of substrates in which conductors are wired; and an insulation material to which first insulation particles each having a first particle diameter are added. The multilayer substrate has a lamination structure such that, in two of the substrates adjacent to each other among the plurality of substrates having been laminated, the first insulation particles, each having the first particle diameter substantially the same as the interval between the conductors on the two substrates, are disposed so as to be respectively brought into contact with the conductors wired on the adjacent two substrates.
