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18741727. HIGHLY THERMALLY CONDUCTIVE HYBRID THERMAL INTERFACE MATERIAL (HONEYWELL INTERNATIONAL INC.)

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HIGHLY THERMALLY CONDUCTIVE HYBRID THERMAL INTERFACE MATERIAL

Organization Name

HONEYWELL INTERNATIONAL INC.

Inventor(s)

Yaqun Liu of Hangzhou (CN)

Qian Yang of Shanghai (CN)

Jin Chang of Shanghai (CN)

Kai Wang of Shanghai (CN)

HIGHLY THERMALLY CONDUCTIVE HYBRID THERMAL INTERFACE MATERIAL

This abstract first appeared for US patent application 18741727 titled 'HIGHLY THERMALLY CONDUCTIVE HYBRID THERMAL INTERFACE MATERIAL



Original Abstract Submitted

A thermal interface material including at least a diamond-containing filler; a silicone oil, as well as a plurality of additives.

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