20240021416. CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
Contents
CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT
Organization Name
Taiwan Semiconductor Manufacturing Company Limited
Inventor(s)
Ming-Sze Chen of Hsinchu City (TW)
Hung-Chih Wang of Taichung City (TW)
Yuan-Hsin Chi of Taichung County (TW)
Sheng-Yuan Lin of Hsinchu City (TW)
CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240021416 titled 'CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT
Simplified Explanation
The abstract describes a connect structure for semiconductor processing equipment. It involves a housing that is designed to connect a deformable pipe with a non-deformable pipe. The housing has a first annular sidewall to receive the deformable pipe and a second annular sidewall with a threaded structure. An annular bead is connected to the first sidewall to flexibly deform the deformable pipe towards the non-deformable pipe when the threaded structures engage each other.
- The connect structure is designed to connect a deformable pipe with a non-deformable pipe in semiconductor processing equipment.
- The housing of the connect structure has a first annular sidewall to receive the deformable pipe.
- The housing also has a second annular sidewall with a threaded structure.
- An annular bead is connected to the first sidewall to flexibly deform the deformable pipe towards the non-deformable pipe when the threaded structures engage each other.
Potential applications of this technology:
- Semiconductor processing equipment
- Industrial piping systems
- Chemical processing equipment
Problems solved by this technology:
- Ensures a secure and flexible connection between a deformable pipe and a non-deformable pipe in semiconductor processing equipment.
- Prevents leaks and maintains the integrity of the piping system.
- Allows for easy installation and removal of the pipes.
Benefits of this technology:
- Improved reliability and efficiency in semiconductor processing equipment.
- Reduces the risk of leaks and potential damage to the equipment.
- Simplifies the installation and maintenance process of the pipes.
Original Abstract Submitted
a connect structure for semiconductor processing equipment includes a housing configured to mate a deformable pipe with a non-deformable pipe. the housing includes a first annular sidewall to receive the deformable pipe and a second annular sidewall defining a first thread structure. an annular bead is connected to the first annular sidewall to flexibly deform the deformable pipe toward the non-deformable pipe structure when the first thread structure rotatably engages a second thread structure of the non-deformable pipe.