Tesla, inc. (20250006600). SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE

SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE

Organization Name

tesla, inc.

Inventor(s)

William Thomas Chi of Fremont CA (US)

Utkarsh Raheja of Sunnyvale CA (US)

Sesha Sai Srikant Sarma Gandikota of San Jose CA (US)

SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE

This abstract first appeared for US patent application 20250006600 titled 'SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE

Original Abstract Submitted

the present disclosure relates to a semiconductor package. the semiconductor package includes a semiconductor die and a plurality of leads. the plurality of leads includes two drain leads connected to the drain, two source leads connected to the source, a gate lead connected to the gate, the gate lead positioned between the two source leads, and a sensing lead positioned between the two source leads. the two source leads, the gate lead, and the sensing lead are positioned on a first side of the semiconductor package that is opposite to a second side of the semiconductor package, and wherein the drain leads are positioned on the second side.