SiPLP Microelectronics (Chongqing) Limited Patent Application Trends in 2025
Revision as of 08:12, 2 January 2025 by Wikipatents (talk | contribs) (Updating SiPLP Microelectronics (Chongqing) Limited_Patent_Application_Trends_in_2025)
Contents
- 1 SiPLP Microelectronics (Chongqing) Limited Patent Filing Activity
- 2 SiPLP Microelectronics (Chongqing) Limited patent applications in 2025
- 3 Top 10 Technology Areas
- 4 Emerging Technology Areas
- 5 Top Inventors
- 6 Patent Categories
- 7 Geographical Distribution of Inventors
- 8 Geographical Distribution of US Inventors
SiPLP Microelectronics (Chongqing) Limited Patent Filing Activity
SiPLP Microelectronics (Chongqing) Limited patent applications in 2025
_Limited_Monthly_Patent_Applications_2025_-_Up_to_2025.png)
Top 10 Technology Areas
_Limited_Top_Technology_Areas_2025_-_Up_to_2025.png)
- H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L23/3736 ({Metallic materials ()
- H01L21/76224 ({using trench refilling with dielectric materials (trench filling with polycristalline silicon)
- H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({)
- H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/05005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/05023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Emerging Technology Areas
_Limited_Top_Emerging_Technology_Areas_2025_-_Up_to_2025.png)
- H01L21/563 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240087912. SEMICONDUCTOR PACKAGING METHOD (SiPLP Microelectronics (Chongqing) Limited)
- H01L21/4828 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
- Count: 1 patents
- Example: 20240087912. SEMICONDUCTOR PACKAGING METHOD (SiPLP Microelectronics (Chongqing) Limited)
- H01L21/4825 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
- Count: 1 patents
- Example: 20240087912. SEMICONDUCTOR PACKAGING METHOD (SiPLP Microelectronics (Chongqing) Limited)
- H01L2224/221 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/215 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/2105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L23/3135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Top Inventors
_Limited_Top_Inventors_2025_-_Up_to_2025.png)
- Weiyuan YANG (3 patents)
Patent Categories
_Limited_Patent_Categories_2025_-_Up_to_2025.png)
Geographical Distribution of Inventors
_Limited_Inventor_Countries_2025_-_Up_to_2025.png)
Geographical Distribution of US Inventors
SiPLP Microelectronics (Chongqing) Limited Inventor States 2025 - Up to 2025
Categories:
- Pages with broken file links
- SiPLP Microelectronics (Chongqing) Limited
- Companies
- CPC H01L23/3736
- CPC H01L21/76224
- CPC H01L23/3121
- CPC H01L23/5389
- CPC H01L24/05
- CPC H01L24/29
- CPC H01L25/0657
- CPC H01L2224/05005
- CPC H01L2224/05023
- CPC H01L2224/29006
- CPC H01L2224/29026
- CPC H01L2225/06524
- CPC H01L2225/06555
- CPC H01L2924/01029
- CPC H01L2924/0665
- CPC H01L2924/182
- CPC H01L2924/3511
- CPC H01L24/19
- CPC H01L21/568
- CPC H01L24/20
- CPC H01L23/3135
- CPC H01L2224/19
- CPC H01L2224/2105
- CPC H01L2224/211
- CPC H01L2224/215
- CPC H01L2224/221
- CPC H01L21/4825
- CPC H01L21/4828
- CPC H01L21/563
- Patent Trends by Company in 2024
_Limited_Inventor_States_2025_-_Up_to_2025.png){kind=link}