Samsung electronics co., ltd. (20240429198). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Jing Cheng Lin of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
This abstract first appeared for US patent application 20240429198 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Original Abstract Submitted
a method of manufacturing a semiconductor package according to embodiments of the present disclosure has an effect of reducing the size of the semiconductor package by minimizing a distance between semiconductor chips by self-aligning the semiconductor chips on pads having fine gaps due to the surface tension of solder bumps.