Intel corporation (20240431066). HEAT EXCHANGE APPARATUS AND METHODS FOR HYPERBARIC COOLING FAN APPLICATIONS

HEAT EXCHANGE APPARATUS AND METHODS FOR HYPERBARIC COOLING FAN APPLICATIONS

Organization Name

intel corporation

Inventor(s)

Jeff Ku of Taipei City (TW)

Chi Chou Cheng of Taoyuan City (TW)

Jeffrey Ho of New Taipei City (TW)

Chih-Tsung Hu of New Taipei City (TW)

Srinivasarao Konakalla of Bangalore (IN)

Tsung-Kai Lin of New Taipei City (TW)

Arnab Sen of Whitefield (IN)

Chiu-Chun Wang of Taoyuan City (TW)

Jiacheng Wu of Taipei City (TW)

HEAT EXCHANGE APPARATUS AND METHODS FOR HYPERBARIC COOLING FAN APPLICATIONS

This abstract first appeared for US patent application 20240431066 titled 'HEAT EXCHANGE APPARATUS AND METHODS FOR HYPERBARIC COOLING FAN APPLICATIONS

Original Abstract Submitted

heat exchange apparatuses and methods for hyperbaric cooling fan applications such as computing devices. the apparatus comprises a material with high thermal conductivity and is configured to be overlaid on an internal surface of the housing, such that an internal surface of the apparatus is exposed to the hot air flowing inside the housing, and an external surface of the apparatus occludes at least some of the existing through-holes of the housing. in operation, the apparatus converts the through-holes into passive heat exchanging regions that passively transfer heat from inside the housing to outside the housing, which brings the internal air temperature and junction temperature (tj) of the heat generating components down. provided embodiments do not require reworking of the original industrial design (id) of the housing.