Intel corporation (20240429588). MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SECOND ADJACENT DIELECTRIC WAVEGUIDES HAVING DIFFERENT CORE AND/OR CLADDING MATERIALS
MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SECOND ADJACENT DIELECTRIC WAVEGUIDES HAVING DIFFERENT CORE AND/OR CLADDING MATERIALS
Organization Name
Inventor(s)
Diego Correas-serrano of Tempe AZ (US)
Georgios Dogiamis of Chandler AZ (US)
Henning Braunisch of Phoenix AZ (US)
Neelam Prabhu Gaunkar of Chandler AZ (US)
Telesphor Kamgaing of Chandler AZ (US)
MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SECOND ADJACENT DIELECTRIC WAVEGUIDES HAVING DIFFERENT CORE AND/OR CLADDING MATERIALS
This abstract first appeared for US patent application 20240429588 titled 'MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SECOND ADJACENT DIELECTRIC WAVEGUIDES HAVING DIFFERENT CORE AND/OR CLADDING MATERIALS
Original Abstract Submitted
disclosed herein are components for millimeter-wave communication, as well as related methods and systems. in one aspect, a microelectronic support for millimeter-wave communication includes a millimeter-wave communication transmission line, wherein the transmission line includes a trace in a metal layer, wherein the trace is electrically coupled to a via by a via pad in the metal layer; and a ground plane in the metal layer, wherein one or more metal portions contact the via pad and the ground plane.
